Business Wire

Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks

Share

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company.

By leveraging Samsung’s leading-edge foundry and advanced packaging products, Preferred Networks aims to develop powerful AI accelerators that meet the ever-growing demand for computing power driven by generative AI.

Since starting mass production of the industry’s first 3nm process node applying Gate-All-Around (GAA) transistor architecture, Samsung has strengthened its GAA technology leadership by successfully winning orders for the 2nm process with further upgrades in performance and power efficiency.

The cooperation with Preferred Networks marks the first achievement for Japanese companies in the field of large-sized heterogeneous integrated package technologies and Samsung plans to accelerate its leading global advanced package market offensive.1

The 2.5D Advanced Package I-Cube S technology included in the turnkey solutions, is a heterogeneous integration package technology, with multiple chips in one package to enhance inter-connection speed and reduce package size. The use of the silicon interposer (Si-interposer) is crucial in achieving ultra-fine redistribution layer (RDL) and stabilizing power integrity for optimal semiconductor performance. GAONCHIPS, a specialized system semiconductor development company, designed the chip.

"We are excited to lead in AI accelerator technology with Samsung Electronics’ 2nm GAA process. This solution will significantly support Preferred Networks’ ongoing efforts to build highly energy-efficient, high-performance computing hardware that meets the ever-growing computing demands from generative AI technologies, especially large language models.,” said Junichiro Makino, VP and Chief Technology Officer (CTO) of Computing Architecture at Preferred Networks.

"This order is pivotal as it validates Samsung's 2nm GAA process technology and Advanced Package technology as an ideal solution for next-generation AI accelerators," said Taejoong Song, Corporate VP and the head of Foundry Business Development Team at Samsung Electronics. "We are committed to closely collaborating with our customers ensuring that the high performance and low power characteristics of our products are fully realized."

Preferred Networks, headquartered in Tokyo, develops advanced software and hardware technologies by vertically integrating the AI value chain from chips to supercomputers and generative AI foundation models. It provides solutions and products for various industries such as manufacturing, transportation, healthcare, entertainment, and education. The company is one of the major players in the global AI market, achieving first place three times in the past five years on the Green5002 list of supercomputers.

Based on this collaboration, Samsung and Preferred Networks plan to showcase groundbreaking AI chiplet solutions for the next-generation data center and generative AI computing market in the future.3

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, home appliances, network systems, and memory, system LSI, foundry and LED solutions, and delivering a seamless connected experience through its SmartThings ecosystem and open collaboration with partners. For the latest news, please visit the Samsung Newsroom at news.samsung.com.

1 Heterogeneous integration packaging technology integrates different types of chips - such as memory, logic, and sensors - in a single package.
2 Green500: the ranking of the TOP500 supercomputers in the world based on their performance-per-watt efficiency
3 Chiplet Solution: A technology of assembling into a single package with other different chips performing different fuctions through the packaging technologies

View source version on businesswire.com: https://www.businesswire.com/news/home/20240709292190/en/

Contacts

Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com

(c) 2024 Business Wire, Inc., All rights reserved.

Business Wire, a Berkshire Hathaway company, is the global leader in multiplatform press release distribution.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Suzano Agrees US$110 Million Purchase of Two US Industrial Facilities from Pactiv Evergreen13.7.2024 00:29:00 CEST | Press release

Suzano, the world's largest pulp producer, has announced the acquisition of industrial assets from Pactiv Evergreen in the United States. This will expand the company’s operations in North America and marks its entrance into the consumer and food service packaging segments in the region. The transaction is valued at US$110 million and includes two mills in Pine Bluff, Arkansas, and Waynesville, North Carolina, that manufacture liquid packaging board and cupstock. Subject to final regulatory approval expected later this year, these assets will add approximately 420,000 metric tonnes annually of integrated paperboard to Suzano’s production capacity. Alongside the acquisition, Suzano has signed a long-term supply deal with Pactiv Evergreen to provide liquid packaging board for its converting business. Suzano is currently the largest supplier of hardwood market pulp in North America, with US offices in Fort Lauderdale, Florida, and a research and innovation campus close to Vancouver, Canad

Oakio Set to Participate in Batimat Paris 2024 with Innovative WPC Solutions12.7.2024 15:47:00 CEST | Press release

Oakio, a pioneer in eco-friendly and high-performance wood-plastic composite (WPC) products, will be participating in the Batimat Paris 2024 exhibition. The event will be held from September 30 to October 3 at Paris Expo Porte de Versailles, offering a premier platform for showcasing the latest advancements in the construction and building materials industry. Batimat is a globally recognized event that brings together industry leaders, innovators, and professionals to explore the newest trends and technologies in construction. Oakio will be exhibiting at Booth H1-A066, where attendees can discover the full range of Oakio’s innovative products. "We are delighted to be part of Batimat 2024 and to present our comprehensive range of sustainable building solutions," said Juno Zhong, Marketing Director at Oakio. "Our products are designed to meet the growing demand for environmentally responsible and high-performance materials in both residential and commercial projects." The products showca

Nord Anglia Education and Boston College to Demonstrate the Power of Metacognition at the European Conference on Education12.7.2024 15:16:00 CEST | Press release

Dr Kate Erricker, Group Head of Education Research and Global Partnerships at Nord Anglia Education, and Dr Damian Bebell, Assistant Professor at the Lynch School of Education and Human Development, Boston College, will lead a workshop on metacognition at the European Conference on Education (ECE) on Saturday 13 July 2024. Titled “Exploring the Implementation and Outcomes of a Global Metacognition Project”, the workshop will explore how metacognition can improve learning in classrooms and showcase Nord Anglia Education’s pioneering metacognition research project involving 27 schools in 17 countries. Metacognition is being aware of and controlling one’s own learning processes. Studies have shown that metacognition can greatly enhance student learning. “Metacognition bridges the gap between knowledge and understanding,” says Dr Kate Erricker. “By teaching students to be aware of how they think and learn, we’re not just enhancing their academic performance but also preparing them for futu

BLS International Holding Anonim Şirketi (Turkey) Successfully Completes Acquisition of 100% Stake in iDATA12.7.2024 14:32:00 CEST | Press release

BLS International Services Limited, a leading global tech-enabled service partner for governments and citizens, announced the successful completion of the acquisition of 100% stake in iDATA and its wholly owned subsidiaries, through BLS International FZE (WoS of BLS) and BLS International Holding Anonim Şirketi (WoS of BLS International FZE). Turkey-based iDATA, a leading visa service provider with 37+ VACs in 15+ countries, serves Germany, Italy, and the Czech Republic. BLS acquired iDATA for ~Euro 80 Million. In 2023, iDATA reported revenues of ~Euro 27.3 Million and EBITDA of ~Euro 16 Million. This acquisition would further strengthen the overall BLS’ position as one of the leading international player in Visa and Consular services. iDATA’s existing agreements and offices will be aligned into the BLS’s network in 66 countries across the globe, enabling BLS to service more Client Governments in Europe. The transaction will be EPS (Earning per share) accretive to BLS immediately. Mr.

KKR and Palm Capital to Acquire Prime Last-Mile Logistics Asset in Denmark12.7.2024 14:30:00 CEST | Press release

KKR, a leading global investment firm, and Palm Capital, the pan-European real estate private equity specialist today announced the acquisition of a prime last-mile logistics asset in Greater Copenhagen, Denmark, from Catena, the Sweden-based leading logistics developer. The park comprises 47,000 sqm of warehouse and office space and hosts long-term tenant Nemlig.com, the country’s largest provider of direct-to-consumer online food and grocery delivery. The logistics asset is located in Greater Copenhagen and surrounded by excellent infrastructure, uniquely positioned on the city’s new light rail system, which is due to be completed in 2025. In a supply-constrained industrial real estate market with strong growth potential, the asset offers significant upside with potential for further development, including additional warehouse facilities and various asset management initiatives such as energy and asset improvements together with the tenant. Alexander Thams, Director and Head of Nordi

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
HiddenA line styled icon from Orion Icon Library.Eye