Business Wire

First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies

Share

The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The first of the three chips to be developed by the consortium will be ready for deployment in early 2022. The project contributes to strengthening Europe’s technological sovereignty.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211213005527/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

The bonding diagram image shows how the chip IO pads are wired to the package pins. The package is soldered to the printed circuit board. The layout picture depicts how the functional blocks are physically located on the chip. The IO pads that are bonded to the package pins are shown on the sides. Photos: SoC Hub. (Graphic: Business Wire)

The Finnish SoC Hub has set out to develop the domain of SoC design as a pioneer in Europe and to enhance Finland’s competitive position. The SoC Hub initiative, coordinated by Tampere University, Finland, and Nokia, was launched last year. The co-creation activities carried out by the partners go well beyond the scope of a conventional research project.

“The SoC has been developed using the same methods that are used in industrial production, such as design for testability, extensive verification and focusing on system-level integration instead of single modules,” says Ari Kulmala, professor of practice in SoC design at Tampere University.

According to Kulmala, the chip can also be tested by external stakeholders as it includes a development kit, and it can be integrated into a wide range of other systems.

One of the key goals of the SoC Hub project is to enable rapid prototyping for new ideas, for example, in the Internet of things (IoT), machine learning and 5G and 6G technologies in silicon.

The newly taped-out Ballast chip is the first in a series of three chips. The chip will be manufactured by TSMC, the world’s largest manufacturer of semiconductor chips.

The chip is manufactured using TSMC’s recent 22nm Ultra Low Leakage process, which is especially well suited for IoT and Edge devices. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, an AI accelerator, rich sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented. The chip supports both real-time operating systems and Linux simultaneously.

“It has been a pleasure to work with the SoC Hub team. They have been extremely quick to develop the chip, and the quality of the work has been top class,” says Bas Dorren, Director of Business Development at imec.IC-link, part of imec (an R&D hub for nano and digital technologies).

Another two chips taped out in the next two years

Considering its large size, the chip was created in a very short time. The ambitious goal was achieved thanks to the good team spirit and the expertise and experience of the specialists involved.

“A great deal of work has been done to enable seamless collaboration between the University and company partners. Several early career researchers have participated in designing Ballast and have therefore had the opportunity to apply the knowledge they acquired from their studies in an industrial project,” says Timo Hämäläinen, head of the Computing Sciences Unit at Tampere University.

Besides the development of the SoC, the first phase of the project was also a major undertaking, involving building the consortium and the preparation of the necessary software and licence agreements. Headed by Tampere University and Nokia, the consortium comprises CoreHW, VLSI Solution, Siru Innovations, TTTEch Flexibilis, Procemex, Wapice and Cargotec as partners.

In the project funded by Business Finland, three SoCs will be taped out by the end of 2023. Use cases for the chips will be planned together with the project consortium.

“In the next phases of the project, we will be able to focus even more on the systematics, automation and performance of the SoCs. Despite having achieved our first goal, we continue moving forward right away. The time to invest in SoC development is now, not tomorrow,” emphasises Timo Hämäläinen.

Tampere University

The multidisciplinary Tampere University is the second largest university in Finland. The spearheads of our research and learning are technology, health and society. The University is committed to addressing the greatest challenges that are facing our society and creating new opportunities. Almost all the internationally recognised fields of study are represented at the University. Together, Tampere University and Tampere University of Applied Sciences comprise the Tampere Universities community made up of more than 30,000 students and close to 5,000 employees.www.tuni.fi/en

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Inquiries:
SoC Hub consortium
sochub@tuni.fi

Timo Hämäläinen
Head of the Computing Sciences Unit at Tampere University
timo.hamalainen@tuni.fi

Ari Kulmala
Professor of practice in System-on-Chip design at Tampere University
ari.kulmala@tuni.fi

About Business Wire

Business Wire
Business Wire
24 Martin Lane
EC4R 0DR London

+44 20 7626 1982http://www.businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Textron Aviation Defense Secures First Contract to Deliver Beechcraft T-6 Texan II Integrated Training System to Japan22.12.2025 02:00:00 CET | Press Release

Textron Aviation Defense LLC, a Textron Inc. (NYSE:TXT) company, today announced that the company has finalized its first contract to deliver the Beechcraft T-6JP Texan II integrated training system to Japan’s Air Self-Defense Force (JASDF), in coordination with Kanematsu Corporation. The initial contract includes two Beechcraft T-6JP Texan II aircraft and instructor pilot and aircraft maintainer training materials. Deliveries of the first two aircraft are scheduled for 2029, with additional contracts anticipated. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251221925354/en/ The Beechcraft T-6 Texan II is designed and manufactured by Textron Aviation Defense LLC, a wholly owned subsidiary of Textron Aviation Inc. “This contract marks a pivotal step in strengthening Japan’s next-generation pilot training capabilities,” said Travis Tyler, president and CEO, Textron Aviation Defense. “We’re honored to support the Japan Air Se

IonQ och QuantumBasel förlänger sitt långsiktiga samarbete till nästa generations kvantsystem20.12.2025 21:32:00 CET | Pressmeddelande

IonQ (NYSE: IONQ), världens ledande kvantdatorföretag, tillkännagav i dag ett utökat samarbetsavtal med QuantumBasel, kvantinitiativet vid uptownBasel, Schweiz internationella innovationscampus. Genom det utökade avtalet beviljas QuantumBasel äganderätten till det befintliga IonQ Forte Enterprise-systemet och blir ägare av ett nästa generationens Tempo-system. Det nya avtalet ökar det totala värdet av samarbetet mellan QuantumBasel och IonQ till över 60 miljoner USD samtidigt som IonQ:s roll i Schweiz därigenom förlängs i ytterligare fyra år, t.o.m. 2029. QuantumBasel är IonQ:s officiella innovationscenter i Europa och fungerar som ett nav för europeiska industrier, universitet och forskningsinstitut som vill utforska praktiska kvantdatortillämpningar och få tillgång till IonQ:s senaste storföretagssystem. ”Vårt förlängda samarbete med QuantumBasel utgör en hörnsten i IonQ:s globala strategi”, säger Niccolo de Masi, styrelseordförande och CEO på IonQ. ”QuantumBasel fortsätter att vara

EIG Acquires a 49.87% Stake in Transportadora de Gas del Perú (TgP)19.12.2025 18:42:00 CET | Press Release

EIG, through its managed investment vehicles, acquired a 49.87% equity stake in Transportadora de Gas del Perú S.A. (“TgP”) from Canada Pension Plan Investment Board today. TgP operates Peru’s principal natural gas and natural gas liquids pipelines under a long-term concession, supplying approximately 40% of the country’s power generation. “We are delighted to complete this transaction and embark on the next chapter of our partnership with TgP,” said Matt Hartman, EIG’s Global Head of Infrastructure. “Our priority is to support TgP’s operational excellence and long-term stability, delivering value for customers and stakeholders throughout Peru.” About EIG EIG is a leading institutional investor in the global energy and infrastructure sectors with $24.3 billion assets under management as of September 30, 2025. EIG specializes in private investments in energy and energy-related infrastructure on a global basis. During its 43-year history, EIG has committed over $51.7 billion to the energ

Klarna Partners With Coinbase to Add Stablecoin to Funding Mix19.12.2025 18:00:00 CET | Press Release

Klarna, the global digital bank and flexible payments provider, has partnered with Coinbase to add stablecoin funding to its broad range of traditional sources of funding, which include consumer deposits, long-term loans and short-dated commercial paper. The digital bank plans to raise short-term funding from institutional investors denominated in USDC utilizing Coinbase’s digitally native infrastructure. Adding a USDC-denominated funding source enables Klarna to access USD-like funding directly, tapping into a new pool of institutional investors. “This is an exciting first step into a new way to raise funding,” said Niclas Neglén, Chief Financial Officer, Klarna, “Stablecoin connects us to an entirely new class of institutional investors, and gives us the potential to diversify our funding sources in ways that simply weren't possible a few years ago. This is just the beginning of how digital assets can work alongside our traditional funding sources." Klarna chose Coinbase for this ini

CyberArk Named a Leader in IDC MarketScape: Worldwide Integrated Solutions for Identity Security 202519.12.2025 17:00:00 CET | Press Release

CyberArk (NASDAQ: CYBR), the global leader in identity security, today announced that it has been recognized as a Leader in the IDC MarketScape: Worldwide Integrated Solutions for Identity Security 2025 Vendor Assessment. CyberArk extends dynamic privilege controls across all identity types with its unified platform, enabling organizations to improve efficiencies and streamline security operations. This IDC MarketScape report notes, “More change has occurred in the identity security marketplace in the past two years than in almost a decade. Vendors are entering a new phase defined by the emergence of intelligence technologies, none of which are specifically defined by any industry standards. Though different by design, the new adjacent IAM offerings are largely focused on improved vulnerability and threat management visibility and automated and predictive attack detection capabilities.” It also notes, “By addressing these evolving identity types within a unified framework, CyberArk enh

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye