Business Wire

Toshiba Showcases End-to-End Innovations Shaping What’s Next in Retail at EuroShop 2026

17.2.2026 15:45:00 CET | Business Wire | Press Release

Share

At EuroShop 2026, Toshiba Global Commerce Solutions will showcase how retailers across Europe are using scalable, sustainable innovation to address today’s challenges and build what’s next. Exhibiting in Hall 6, Booth C41 from the 22nd to 26th February, Toshiba will demonstrate technologies designed to evolve with retailers, empowering flexibility, resilience, and long-term growth, and prepare them for what’s next.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260216755053/en/

At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent solutions to deliver lasting impact.

“Retailers are under pressure to move faster, operate more efficiently, and deliver better experiences than ever before. At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent, solutions to deliver lasting impact,” said Andrew McDaniel, Managing Director and SVP of Europe at Toshiba Global Commerce Solutions.

Toshiba's portfolio empowers retailers across all segments to modernize at their own pace, using modular, scalable solutions that leverage AI and computer vision to drive smarter operations, faster experiences, and measurable outcomes. From dynamic hardware and flexible software to wall-to-wall services, Toshiba empowers retailers to scale innovation while also operating more efficiently. Featured technologies on display will include:

  • VisualStore: A unified platform that integrates all channels, services, and promotions to help retailers in every retail segment deliver personalized, seamless, and engaging customer experiences from grocery, convenience and fuel to fashion and food service.
  • ELERA® Commerce Platform: Supports retailers with an open foundation for seamless integration across systems and technologies and applying AI at the edge where it delivers the most value, including loss prevention.
  • End-to-End Services: Expert staging, installation, and maintenance support to ensure reliability, uptime, and reduced environmental impact through longer system lifecycles.
  • MxP™ Vision Kiosk: Combines AI-driven intelligence with a compact design to create a fast, seamless, and secure grab-and-go checkout experience.
  • MxP™ SMART: A compact, versatile self-checkout solution that maximizes throughput and operational efficiency in space-constrained retail environments.
  • POS and Mobile Solutions: Including the TCx® 820, TCx® 900, TCx® 620 POS and the mobile TCx® M7 handheld and TCx® M11 tablet, built for flexible store formats, faster checkout, and seamless shopper experiences.

Toshiba’s ability to help retailers scale innovation is reflected in real-world deployments across Europe. In the UK, fashion and homeware value retailer Matalan is implementing Toshiba’s VisualStore commerce platform to support faster, smoother, and more connected shopping across channels, demonstrating how AI- and CV-driven platforms can be expanded to enhance in-store experiences while supporting broader transformation goals.

Collaboration remains central to Toshiba’s strategy. By working with world-class partners, Toshiba delivers an open, ecosystem-driven approach focused on measurable outcomes and retailers’ best interests, ensuring solutions are adaptable, future-ready, and capable of evolving as market demands change. Toshiba’s featured partners at EuroShop 2026 bring expertise in payments, retail media, RFID, printing, and hardware solutions, including: Adyen, Catch, CPI, Datalogic, Ergonomic Solutions, Market Pay, Nedap, and Worldline.

Toshiba experts will also be featured on stage at two thought leadership speaking opportunities during the show.

  • Safer SCO: Strengthening Self-Checkout Security and the Bottom Line
    24th, Feb. at 12:20 – Blue Stage (Hall 6 / 103)
    Speakers: Roar Brevik from Coop Norway with Rob MacIntyre and Raine Haapasaari, from Toshiba
  • AI in Retail: Are we doing it right?
    25th Feb. at 14:40 – Red Stage (Hall 6 / 161)
    Speakers: Martin Ward from Toshiba

To learn more or schedule a meeting with Toshiba at EuroShop, visit: Book your meeting at EuroSHOP 2026

About Toshiba Global Commerce Solutions:

Toshiba Global Commerce Solutions empowers retail to thrive and prosper through a dynamic ecosystem of smarter, more agile solutions and services that enable retailers to resiliently evolve with generations of consumers and adapt to market conditions. Supported by a global organization of devoted employees and partners, retailers gain more visibility and control over operations while enjoying the flexibility to build, scale, and transform retail experiences that anticipate and fulfill consumers’ ever-changing needs.

Visit commerce.toshiba.com and engage with us on:

LinkedIn - YouTube - Facebook - Instagram: @toshibacommerce

X/Twitter: @ToshibaCommerce

Toshiba Global Commerce Solutions is a wholly owned subsidiary of Toshiba Tec Corporation, which is traded on the Tokyo Stock Exchange.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260216755053/en/

Contacts

MEDIA CONTACTS:
Meike Marquardt
Head of Marketing, Europe
mmarquardt@toshibagcs.com

Robin Lyon
Executive Director – Channels & Marketing, Europe
robin.lyon@toshibagcs.com

Toshiba Global Commerce Solutions

(c) 2024 Business Wire, Inc., All rights reserved.

Business Wire, a Berkshire Hathaway company, is the global leader in multiplatform press release distribution.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press Release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press Release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press Release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press Release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press Release

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye