Ferric Launches Fe1767 Newport Dual-Sided IVR for AI and High-Performance Processors

Ferric, the leader in integrated voltage regulator technology, today announced the Fe1767 Newport, a 145 A dual-sided IVR designed for AI and high-performance processors.

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Newport creates a direct vertical power path through the IVR. Input power enters from the PCB-facing side, while regulated output power exits toward the processor. This shorter electrical path reduces PDN impedance and limits voltage droop during fast processor load transients.

Under equivalent load-step conditions, Newport cuts transient droop by 19% to 30% compared with competing IVRs, and by up to approximately 57% compared with traditional lateral power delivery. Its direct power path also reduces power rail PDN impedance by 42% to 63% compared with backside PCB attachment, depending on the integration configuration.

Lower impedance and droop give processor designers greater headroom to reduce voltage guardbands and output-capacitance requirements, improving overall power delivery efficiency while decreasing the solution footprint.

Fe1767 Newport Key Features

• Dual-sided termination for direct vertical power delivery
• 145 A thermal design current and 2.9 A/mm² current density
• 5.6 × 8.9 × 1.2 mm package
• Up to 90.5 % efficiency at 1.8 V input and 0.75 V output
• 1.2 V to 2.0 V input and 0.25 V to 1.25 V output
• 15 MHz nominal switching frequency, programmable from 10 MHz to 60 MHz

“Delivering current is only part of the challenge—the harder problem is delivering it to the processor without excessive impedance and voltage droop,” said Noah Sturcken, CEO of Ferric. “Newport’s dual-sided architecture shortens that path, giving processor designers tighter voltage regulation in a compact, high-current solution.”

The Fe1767 Newport is currently sampling, with samples and evaluation boards available to qualified customers. To learn more or request an evaluation, visit Ferric.com.

About Ferric

Ferric develops integrated voltage regulators that improve power density, efficiency and dynamic performance for AI, datacenter and high-performance computing systems. Ferric’s proprietary thin-film magnetic technology enables compact, high-current power conversion close to the processor.

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