Advancing core technologies for next-generation vehicles

Mr. Hong-Yong Bae, Executive Vice President and CTO of HL Mando, stated,

“Through this collaboration with RISE, HL Mando will further strengthen its global technological competitiveness and create new innovations in electrification and intelligent control fields.”

Mr. Björn Samel, Head of Smart Hardware and Vice President of RISE, commented,

“We are excited to partner with HL Mando to accelerate innovation in next-generation mobility. By combining RISE’s expertise in international standards and advanced power semiconductor technologies with HL Mando’s pioneering solutions, we aim to push the boundaries of safety, efficiency, and sustainability in electrified vehicle systems.”

Through this agreement, HL Mando and RISE will pursue various collaborations aimed at advancing core technologies for next-generation vehicles. First, they will jointly develop a Board Circuit Isolation (BCI) device, a key component for Electro Mechanical Brake (EMB) systems, to enhance safety and reliability required in the era of electrified mobility.
Second, the two institutions will expand research in autonomous driving control technologies and eco-friendly, sustainable materials, promoting innovation in next-generation green mobility.
Third, they will foster joint research projects and personnel exchanges, thereby strengthening international cooperation and enhancing global technological competitiveness.

The two organizations will also establish a joint steering committee to enhance R&D efficiency and jointly develop demonstration and standardization frameworks.In particular, the partners will focus on meeting international regulatory standards by designing vehicle systems based on dual-redundant power architectures to ensure safety compliance.

Based on this MOU, HL Mando and RISE plan to continue expanding their cooperation through joint R&D initiatives, participation in international research programs, and technical personnel exchanges.